TE launches microQSFP connector

TE Connectivity (TE) has introduced its next-generation pluggable input/output (I/O) interconnect solutions, the Micro Quad Small Form-Factor Pluggable (microQSFP) product line. microQSFP connectors can help address major challenges in data storage including bandwidth, thermal performance, and power consumption. TE is a member of the microQSFP Multi-Source Agreement (MSA) group that brings the microQSFP to market, which has pioneered a new ecosystem for the microQSFP in the industry and ensures smooth integration of the product in the design of existing data. application.

The growing consumer demand for video content distribution and streaming Internet services places higher demands on bandwidth, yet the bulk of standard I/O connectors and external heat sinks in existing devices limit their data throughput improvements. The microQSFP can achieve the same excellent performance as the QSFP28, but it is smaller than the QSFP28, the same as the SFP, and provides better thermal performance to save energy. At the same time, this product line not only improves electronic performance, reaching 25Gbps per channel, but also increases the contact density by 33% compared with QSFP to undertake more ports on a single standard line card.

Phil Gilchrist, technical officer of TE's data and terminal equipment business unit, said: "The market continues to put forward higher requirements for the size and thermal performance of product panels, and TE's microQSFP products not only fully meet these two requirements, but its technological innovation can also Supporting a high capacity of up to 100Gbps per 72 ports on a 1RU line card brings an innovation in the connector industry."

The new microQSFP meets the demands of next-generation designs with 56Gbps per lane transmission performance and 28Gbps per lane backward compatibility. Its built-in heatsink integrates the functionality of additional snaps and heatsink parts and helps enable panel air flow inside the device, enabling the microQSFP to achieve better thermal performance than existing advanced solutions such as the QSFP28.